Epoxy curing agent Knowledge How to identify the quality of electronic potting glue

How to identify the quality of electronic potting glue

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In the electronics industry, potting glue is the main Packaging materials, whether they are semiconductor components such as discrete devices, integrated circuits, large-scale integrated circuits, or electronic components such as printed circuit boards, automotive electronics, automotive wiring harnesses, connectors, and sensors, are usually packaged in the final process.

Therefore, it is particularly important to choose a high-quality potting glue suitable for your product. So, how to identify the quality of electronic potting glue?

1. QualityVery goodelectronic potting glue

has the properties of high elasticity, high toughness, high tensile force, high adhesion and bonding force, using high quality Products after electronic encapsulation can withstand various environmental tests;

After one, two or more years, it can maintain stable performance, and the change in the shrinkage rate of the glue is very small. There are also special requirements in terms of performance, that is, additional thermal conductivity, flame retardant properties, etc.

2. Medium quality Electronic potting glue

andVery good qualityComparison of electronic potting glue,The medium one looks slightly worse,has a certain degree of elasticity, softness, and good stretch length, but the tensile strength and strength are not ideal; after a period of After two or more years, it can maintain good stability and the shrinkage rate of the glue will change less.

3. Quality

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Generalelectronic potting glue

It has a certain degree of elasticity, softness, and good stretch length, but the tensile strength and strength are not very ideal; the adhesion and bonding force are relatively low. After many years of use, this type of product has a significant shrinkage rate. , the greater the shrinkage, the lower the pure material content of the glue, and the cost is relatively cheap.

On the contrary, the smaller the shrinkage, the higher the pure material content of the glue, and the cost is relatively high. If pure materials are excessively reduced due to vicious competition in the market and the technology is immature, there may be unpredictable quality and safety hazards, such as shedding, silicon cracking, decomposition and oil flow, etc.


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This article is from the Internet, does not represent the position of Epoxy curing agent, reproduced please specify the source.https://www.dmp-30.vip/archives/24662

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