Epoxy curing agent News Electroplating solutions are mainly used in electroplating technology. The market space for electroplating solutions for advanced packaging is expected to expand.

Electroplating solutions are mainly used in electroplating technology. The market space for electroplating solutions for advanced packaging is expected to expand.

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Electroplating solution refers to a solution used in electroplating technology to improve the performance of the coating. The electroplating solution must have the advantages of good chemical stability, strong buffering capacity, good conductivity, strong dispersion ability, and fast plating speed. It is widely used in many fields such as machinery manufacturing, electronics and electrical, construction engineering, and automobile manufacturing. According to different raw materials, electroplating solutions can be divided into various types such as sulfate galvanizing, cyanide galvanizing, chloride galvanizing and zincate galvanizing.

Different types of electroplating solutions also have different characteristics. Sulfate galvanizing has the advantages of low production cost and simple production process, but its quality is poor and its scope of application is narrow; cyanide galvanizing has excellent overall performance, but it can easily cause environmental pollution and its use has been restricted; chloride galvanizing Zinc includes three types: potassium chloride galvanizing, sodium chloride galvanizing and ammonium chloride galvanizing. Among them, potassium chloride galvanizing has the advantages of green environmental protection, high raw material utilization rate, good conductivity, etc., and is a mainstream product in the electroplating solution market. .

Electroplating solutions are mainly used in electroplating technology and have broad application prospects in many fields. In the field of machinery manufacturing, electroplating liquid can be used to enhance the wear resistance of mechanical parts and improve the surface quality of mechanical shells; in the field of construction engineering, electroplating liquid can be used to process electroplated stone, and the products are widely used in building exterior walls and architectural sculptures; In the field of automobile manufacturing, electroplating solutions can be used to process automobile structural parts, automobile outer protective films, etc. Benefiting from the rapid development of electroplating technology, my country’s demand for electroplating liquid applications continues to grow.

According to the “2023-2028 China Electroplating Solution Industry Market In-depth Research and Development Prospects Forecast Report released by the Industrial Research Center, electronics The electrical field is the largest demand side for electroplating solutions, which are usually used in the semiconductor packaging process. Semiconductor packaging technology can be divided into three types: traditional packaging technology, surface mount technology and advanced packaging technology. Compared with traditional packaging technology, advanced packaging technology (HDAP) has the advantages of high density, miniaturization, low power consumption, and lightweight, and will be widely used in the semiconductor packaging process in the future. In this context, the market space for electroplating solutions for advanced packaging will further expand.

The main electroplating solution manufacturers in my country include Shanghai Xinyang, Anji Technology, Feikai Materials, Sanfu Xinke, etc. Shanghai Xinyang focuses on the research and development, production and sales of semiconductor materials, and has the mass production capacity of HBM copper electroplating solution. According to its semi-annual report, the company achieved revenue of 550 million yuan in the first half of 2023, a year-on-year increase of 0.4%.

Industry analysts said that electroplating liquid, as an important material used in electroplating technology, is widely used in many fields and the industry has good development prospects. In recent years, thanks to technological progress and the continued efforts of local companies, the output and quality of electroplating solutions in my country have continued to improve. It is expected that in the future, companies with mass production capabilities for advanced packaging electroplating solutions will occupy a larger space in my country’s electroplating solution market.

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