Polyimide adhesives have broad application prospects. The global market is mainly concentrated in the United States, Japan and other countries.

Polyimide (PI) refers to a type of polymer containing imide rings in the main chain. It is currently the most practical type of polymer material with the strongest high temperature resistance. It is used in aviation, microelectronics, It is widely used in nanometer, laser and other fields. Polyimide adhesives, referred to as PI adhesives, refer to adhesives with polyimide as the main component. The main types include polycondensation PI adhesives, thermoplastic PI adhesives, PI silicone block copolymer adhesives, and polyamide-imide Adhesives, etc.

Polyimide adhesive has good atomic radiation resistance, high temperature mechanical properties, corrosion resistance, dielectric properties, chemical stability, etc. It meets the requirements for bonding aluminum, stainless steel, titanium alloy and other metals, and can be widely used in aerospace, aerospace, Satellite communications, electrical insulation, microelectronics industry, national defense industry, precision electronic machinery and other high-precision fields.

According to the “Polyimide Adhesive Industry Market In-depth Research and Investment Prospects Forecast Analysis Report 2023-2028” released by the Industrial Research Center It shows that polyimide adhesive has a wide range of applications and can solve the problem of low upper heat resistance temperature of other organic adhesives. It is a high-performance adhesive product. Against the background of the rapid development of global cutting-edge industries, the market demand for polyimide adhesives continues to rise. In 2022, the global polyimide adhesive market demand has reached 137,000 tons, a year-on-year increase of 6.1%.

The United States and Japan were the first countries to develop polyimide adhesive research and development. In the 1970s, NASA, Hughes Aircraft Company, and DuPont conducted research and development of PI adhesives to meet the demand for high-end adhesives in the aerospace field, and successively developed LARC-TPI, LARC-13, and NR-150R2PI. PI adhesive products including , NR056X-PI, etc., have been successfully applied on a variety of aircraft. Since then, through continuous research and development, in the 1990s, Amoco and Cytec of the United States and Mitsui Tokyo Chemicals of Japan became the world’s leading manufacturers of PI adhesives.

Thanks to the first-mover advantage, the United States, Japan and other developed countries have now become global polyimide adhesive production capacity and high-end technology concentration centers, and a number of leading companies with scale and technological advantages have emerged, such as NASA, DuPont of the United States, Mitsui Chemicals of Japan, etc. Among them, DuPont of the United States is the leading company in the global polyimide adhesive market, occupying a large market share.

Industry analysts said that polyimide adhesive is a type of high-performance adhesive product. At present, it has become a micro-product due to its good performance. As key bonding materials in cutting-edge fields such as electronics, aviation, and military industry continue to highlight their superior performance, their market demand continues to increase, and the industry shows good development prospects. However, the current development of the polyimide adhesive industry still faces difficulties such as high costs, existing product defects, and complex production processes. In the future, relevant R&D companies will need to increase product and technology research and development efforts to seek to reduce costs and increase efficiency of PI adhesives. New ways.