Henkel launches two new caulks

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In response to the requirements of the new generation of products, Henkel has launched two new caulking agents, namely 3500LV and 1400SL. Gap filler 3500LV has high thermal conductivity and low volatility. 1400SL has a very low viscosity to suit the challenging requirements of high thermal conductivity in construction applications.

Lonnie Helgeson, Product Manager of Henkel Gap Filler, said: "The current miniaturization of the industry has put forward new requirements for thermal management. Many current designs are small and complex, so providing suitable thermal control systems It is challenging to fully seal the material. Using liquid materials, which can fill tiny gaps and flow into complex architectures, can ensure product functionality and reliability.”

Caulk 3500LV is a two-component material that cures at room temperature and can be accelerated by heating. It has a high thermal conductivity of 3.5 W/m-K and the excellent mechanical properties of silane while achieving minimal outgassing. Compared to other highly volatile materials, the low volatile content of this caulk is carefully controlled from batch to batch to ensure that emissions are kept to a minimum. Gap Filler 3500LV is suitable for fog-free optical lens applications, such as automotive headlights, stadium lighting and high-intensity LEDs. There are other applications such as industrial PLC controllers on paint production lines, automotive infotainment systems, video cameras and lighting systems that all benefit from the high thermal conductivity and low volatility of 3500LV caulk. Cured caulk 3500LV is a soft material that provides protection against vibration and impact. And its liquid properties can fill tiny gaps, and its zero shrinkage properties can ensure the reliability of the thermal interface, so it is suitable for special thermal control systems.

Gap filler 1400SL has good thermal performance and strong pore filling ability. Compared to conventional products, Gap Filler 1400SL combines low viscosity with a unique formulation designed to meet the challenging requirements of high thermal conductivity in construction applications. Two-component, silane-based liquid caulk 1400SL has a very low viscosity, which gives this material a unique structure that can fill tiny voids and has excellent heat transfer characteristics. With a thermal conductivity of 1.4W/m-K, Gap Filler 1400SL combines high thermal conductivity with excellent flow, two properties that have historically been mutually exclusive, and the combination of these two properties can take designs to new levels. Lonnie Helgeson, product manager for gap fillers at Henkel, said: "In the past, electronics industry experts only required low thermal conductivity of conductive potting compounds, but now manufacturers no longer ignore the requirements for viscosity or thermal conductivity. Gap filler 1400SL , combining these properties in a new material that is self-leveling and reduces shock and vibration.” Cured caulk 1400SL is exceptionally soft, with a coefficient of thermal expansion (CTE) that absorbs stress and can Fragile mechanical components act as shock absorbers. It can be used in many fields, including high-power components such as field-effect transistor storage, industrial controllers for transient loads, and electronic controllers for DC-DC converters in hybrid vehicles. Lonnie Helgeson added, "Gapfiller 1400SL is also a low-volatility material, and fogging during application is a concern, and the product's low-VOC formulation helps to improve this issue." Curing under high temperature will not produce by-products, there is no requirement for thickness during curing, and the curing process can be accelerated by heating up.