Epoxy curing agent Knowledge Preparation and application of tetrahydrophthalic anhydride_Kain Industrial Additive

Preparation and application of tetrahydrophthalic anhydride_Kain Industrial Additive

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Background and overview[1]

Tetrahydrophthalic anhydride is also called tetrahydrophthalic anhydride. Tetrahydrophthalic anhydride has cis and trans isomers, and the trans isomer has two optical isomers, d- and dl-. The cis-isomer precipitates from diethyl ether or petroleum as white flake crystals, and the trans-dl-isomer precipitates from a mixture of benzene and petroleum as white cubic crystals. The trans-isomer is converted into cis-isomer when heated to 200°C. Its use: Monomer for alkyd resin modifier. After modification with this product, the adhesion, elasticity, gloss, water resistance, and salt water resistance of the coating are greatly improved. Used as an epoxy resin curing agent to produce products with excellent electrical properties at high temperatures. A dihydroxy acid monomer used to produce monomers for modifying unsaturated polyester. This modified monomer can improve adhesion and water resistance.

Preparation[3]

Heat 100g of maleic anhydride until melted, add 0.3g of hydroquinone (polymerization inhibitor) and 0.5g of phosphorus pentoxide (isomerization catalyst), and add mixed carbon tetrafluoroethylene at a rate of 1.0g/min. In the maleic anhydride melt, keep the reaction temperature at 100-105°C; use gas chromatography to track and analyze the composition changes of the reaction mixture. When the maleic anhydride content drops to zero, increase the reaction temperature to 160°C and continue the reaction for 2 hours; distill under reduced pressure. Collect the fractions at 120-140°C/5mmHg to obtain 133g of colorless transparent liquid with a purity of 99.2%, a yield of 85%, and a freezing point of <15°C.

Apply[2]

CN201410538834.8 reports a flexible conductive adhesive for direct coating and its preparation method, which consists of 15-20wt% flexible epoxy, 3-8wt% curing agent, 0.1-0.5wt% accelerator, 0.1-0.5 It consists of wt% coupling agent, 65-80wt% silver powder and 0.2-10wt% flexible one-dimensional nano conductive material; the flexible epoxy is bisphenol A epoxy resin grafted with the soft segment of ethylene-vinyl acetate copolymer and aliphatic shrinkage A mixture of glyceryl ether epoxy resins; the curing agent is one or more of methylhexahydrophthalic anhydride, methyltetrahydrophthalic anhydride, and tetrahydrophthalic anhydride; the accelerator is an imidazole compound; coupling The agent is one or more of KH550, KH560 and KH570; the flexible one-dimensional nano-conductive material is carbon nanotubes or conductive metal nanowires; it has excellent conductive properties and good flexibility. After repeated bending, the conductive properties are almost non-existent. changes to meet the needs of flexible electronic products.

References

[1] Practical Fine Chemical Dictionary

[2]CN201410538834.8 A flexible conductive adhesive for direct coating and its preparation method

[3][China Invention, China Invention Authorization] CN200410010078.8 A new method for producing liquid tetrahydrophthalic anhydride [Public]/A method for producing liquid tetrahydrophthalic anhydride [Authorized]

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