Rrapid advances in flexible electronics technology have led to innovative devices such as foldable displays, wearables, electronic skins and medical devices.
These breakthroughs have led to growing demand for flexible adhesives that can quickly regain shape while effectively connecting the various components in these devices. However, traditional pressure-sensitive adhesives (PSAs) often face challenges in achieving a balance between recovery capabilities and bonding strength.
In a study conducted at UNIST, researchers have successfully synthesized new polyurethane cross-linkers to address this critical challenge.
Dong Woog at UNIST School of Energy and Chemical Engineering
Under the leadership of Professor Lee, the research team developed a method using xylylene diisocyanate (XDI) or 1,3-bis(isocyanatomethyl)cyclohexane (H6XDI) as the hard segment and polyethylene glycol ( PEG) group as a new cross-linking agent for soft segments. By incorporating these newly synthesized materials into pressure-sensitive adhesives, their recoverability is significantly improved compared to traditional methods.
Pressure-sensitive adhesives formulated with H6XDI-PEG diacrylate (HPD) exhibit excellent recovery properties while maintaining high bond strength (~25.5 N 25 mm−1).
Through extensive folding testing totaling 100,000 folds and multi-directional tensile testing exceeding 10,000 cycles, the pressure-sensitive adhesive cross-linked with HPD demonstrated superior stability under repeated deformation, demonstrating its ability to perform in applications where flexibility is required. potential for use in robust and recoverable applications.
Furthermore, it shows high light transmittance (>90%) even after subjecting the adhesive to strains of up to 20%, making it suitable for applications such as foldable displays that require not only flexibility but also optical clarity.
Dong Woog
Professor Lee said: “This breakthrough in adhesive technology opens up the possibility for electronic products that require high flexibility and fast recovery properties. Our research solves the long-standing challenge of balancing adhesive strength and elasticity, providing opportunities for the development of flexible electronic devices It opens up new avenues.”
Hyunok, a researcher involved in the study
Park emphasized the importance of this research, saying: “The introduction of this new cross-linked structure enables the adhesive to have excellent bonding and recovery properties. We believe it will drive the future development of adhesive research while also Contribute to the further development of flexible electronics.”
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