● 165 W/m-K high thermal conductivity material for high reliability power discrete packaging in automotive and industrial applications
Henkel Announces Loctite Ablestik ABP 8068TI adds to its growing portfolio of high thermally conductive die attach adhesives. This new pressureless sintered die attach adhesive has a thermal conductivity of 165 W/m-K, the highest thermal conductivity in Henkel's semiconductor packaging portfolio, meeting the performance requirements of high-reliability automotive and industrial power discrete semiconductor devices.
Ramachandran, Head of Global Marketing, Semiconductor Packaging Materials, Henkel Adhesives Electronics Division "High-voltage applications such as automotive advanced driver assistance systems (ADAS), electric vehicles, industrial motor controls, and high-efficiency power supplies require excellent electronic and thermal performance," Trichur said. cooling needs, Sintered silver (Ag) is the only die attach material that can replace lead solder paste. Henkel pioneered the pressureless sintering die attach process, which allows the use of standard processing. Our fourth and highest thermal conductivity material has now been developed to meet the stringent thermal and electrical performance requirements of next-generation power packaging. "
Henkel's latest pressureless sintered die attach adhesive meets multiple specifications for power semiconductors such as MOSFETs, which increasingly use silicon carbide (SiC) and gallium nitride (GaN) materials to replace silicon (Si) to improve efficiency. Loctite ABP 8068TI can be applied to traditional silicon and new generation wide bandgap semiconductors and other power discrete devices. This thermal conductivity is 165 W/m-K's ultra-high thermal conductivity die attach adhesive with superior sintering properties and good adhesion to copper (Cu), pre-plated (PPF), silver (Ag) and gold (Au) leadframes at MSL3 and 1000 It still has excellent conductivity and stable RDS(on) after thermal cycle. Loctite Ablestik The recommended chip size for ABP 8068TI is less than or equal to 3.0 mm x 3.0 mm, Loctite Ablestik ABP 8068TI is fully curable at temperatures of 175°C or above and establishes a rigid sintered silver network at the interface and in the bulk of the epoxy. High pressures are not required to achieve this robust structure because pressureless sintering is the same process as standard die-attach processes, a process that effectively eliminates stress on thin chips. In addition, this material has very good processability, and its dispensing and die attach gap time can reach 3 hours, The gap time between chip mounting and baking can be up to 24 hours, during which there is no significant decrease in processability and adhesion.
As Trichur summarizes, the power device market is only increasing in terms of applications and performance requirements, making high-performance, high-thermal-conductivity die-attach solutions a necessity: The demand for power devices is increasing in all submarkets. For power semiconductors, sintered die attach is currently the most important and reliable solution to achieve the required die attach strength, integrity, and thermal and electrical conductivity. 乐 Ty Abablestik ABP 8068TI meets all these conditions with one product, which simplifies the process and protects thinner and more complex chips. "
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