Tra-Con Introduces Low Tack Conductive Silver Epoxy Adhesive Products

Tra-Con recently launched a conductive silver epoxy resin adhesive TRA-DUCT921M01, which has the characteristics of electrical conductivity and long storage time under low thermal bonding conditions.

Manufactured from a soft, smooth material, the product can be packaged in the company's custom bipax units or pre-mixed cryovials for use in equipment such as automated sorters, screen-printed or hand-held probes.

This adhesive has low viscosity, and the resistance at 25°C is 0.00025Ω-cm (30 minutes at 120°C), 250.00017Ω-cm (15 minutes at 150°C), 0.00051Ω-cm (at 80°C 2 hours), the bonding strength is 1,500psi, the viscosity is 23,000cps (cp#52, 10rpm), and the thixotropic index is 4.

The bonding time of TRA-DUCT921M01 is 24 hours (65°C), 5 to 7 hours (80°C), 30 minutes (120°C) and 15 minutes (150°C).